In all iPhone 7 reports, the elements paid more attention are its
outlook design and cameras. From the recently leaked photo, we can find
iPhone A10 chip expose with unclear size and it is commonly recognized
TSMC Company will monopolize A10 manufacture. As for the details of A10,
it will still use dual-core and TSMC technology, and more outstanding
in design. It is said that the performance of A10 is 20% better than
that of A9. But for its specifications, maybe we will wait to know until
the iPhone 7 teardown.
From this leaked photo, the rumors seem to be true in the design. The three spots on the casing is Smart Connector and it was firstly appeared at 12.9” iPad Pro, which is used for connecting the keypad protective cover. Although there are so many advantages for Smart Connector, it is still not certain whether it will be used in iPhone 7. What’s more, the dual cameras and 3.5mm earphone jack does not appear in this leaked photo, but all of them are still not confirmed and all the truth will be known until new iPhone release.